This 500g spool of Bond no-clean solder wire features a 63/37 tin-lead composition with a 0.81mm diameter and 2.2% flux core. Designed for precision electronic soldering, it ensures reliable joints and minimal residue for industrial and professional assembly applications. Key Features Eutectic 63/37 alloy for smooth soldering Instant melting at 183°C Excellent wetting and fast flow Bright, shiny, reliable solder joints Low residue no-clean flux Minimal spattering and smoke Ideal for precision electronic assembly and repair Applications PCB Assembly Electronics Manufacturing Mobile & Laptop Repair LED Driver Manufacturing Industrial Electronics Automotive Electronics Electrical Maintenance