• Brand: Bond
• Alloy Composition: Sn60 / Pb40 (60% Tin, 40% Lead)
• Type: No-Clean Flux Core Solder Wire
• Wire Size: 1.21 mm (18 SWG)
• Flux Content: 1 Core, 1.2%
• Net Weight: 200 g
• Batch No.: B02200Z18
• Manufacturing Date: February 2026
• Expiry Date: February 2028
• Manufacturer: Khanna Bond Solders Pvt. Ltd., Greater Noida
Product Features
• Excellent wetting and solder flow.
• No-clean flux leaves minimal, non-corrosive residue.
• Suitable for PCB assembly, electronics repair, electrical work, and industrial soldering.
• Melting range: approximately 183–190°C for Sn60/Pb40 solder.
Applications
• PCB soldering
• Through-hole components
• Cable and connector soldering
• Industrial electronic assembly
• Service and repair work
