• Brand: Bond • Alloy Composition: Sn60 / Pb40 (60% Tin, 40% Lead) • Type: No-Clean Flux Core Solder Wire • Wire Size: 1.21 mm (18 SWG) • Flux Content: 1 Core, 1.2% • Net Weight: 200 g • Batch No.: B02200Z18 • Manufacturing Date: February 2026 • Expiry Date: February 2028 • Manufacturer: Khanna Bond Solders Pvt. Ltd., Greater Noida Product Features • Excellent wetting and solder flow. • No-clean flux leaves minimal, non-corrosive residue. • Suitable for PCB assembly, electronics repair, electrical work, and industrial soldering. • Melting range: approximately 183–190°C for Sn60/Pb40 solder. Applications • PCB soldering • Through-hole components • Cable and connector soldering • Industrial electronic assembly • Service and repair work