• Brand: Bond
• Product: No-Clean Solder Wire
• Alloy Composition: 60% Tin (Sn) / 40% Lead (Pb)
• Wire Diameter: 0.81 mm (21 SWG)
• Flux Type: No-Clean
• Flux Content: 2.2%
• Net Weight: 200 g
• Manufacturing Date: March 2026
• Expiry Date: March 2028
• Batch No.: B03170316
• Manufacturer: Khanna Bond Solder Manufacturers Pvt. Ltd., Greater Noida
Key Features
• 60/40 Sn/Pb alloy provides excellent wetting and smooth solder flow.
• No-clean flux leaves minimal, non-corrosive residue, so cleaning is generally unnecessary after soldering.
• Suitable for PCB assembly, electronics repair, component soldering, and general electrical work.
