• Brand: Bond • Product: No-Clean Solder Wire • Alloy Composition: 60% Tin (Sn) / 40% Lead (Pb) • Wire Diameter: 0.81 mm (21 SWG) • Flux Type: No-Clean • Flux Content: 2.2% • Net Weight: 200 g • Manufacturing Date: March 2026 • Expiry Date: March 2028 • Batch No.: B03170316 • Manufacturer: Khanna Bond Solder Manufacturers Pvt. Ltd., Greater Noida Key Features • 60/40 Sn/Pb alloy provides excellent wetting and smooth solder flow. • No-clean flux leaves minimal, non-corrosive residue, so cleaning is generally unnecessary after soldering. • Suitable for PCB assembly, electronics repair, component soldering, and general electrical work.