ALPHA OM-338 Series Ultra Fine Feature Lead-Free Solder Paste Product Description: The ALPHA OM-338 Series is a high-performance, ultra-fine feature lead-free solder paste designed for advanced electronic assembly applications. It delivers superior printability, excellent soldering performance, and outstanding reliability for fine-pitch and high-density PCB designs. Key Features & Benefits: ✅ Ultra-Fine Feature Capability – Ideal for miniaturized components, including 0201 metric and smaller, with superior print consistency. ✅ Excellent Solderability – Provides strong, reliable solder joints with excellent wetting performance across various surface finishes (OSP, ENIG, NiPdAu, etc.). ✅ Outstanding Print Performance – Consistent print volume and shape across a wide range of stencil apertures, reducing defects like bridging and solder balling. ✅ Low Voiding Characteristics – Reduces voiding in critical solder joints, enhancing thermal and electrical reliability. ✅ Wide Process Window – Stable and adaptable across different printing, reflow, and storage conditions. ✅ Residue Management – Minimal residue with excellent compatibility with cleaning processes or no-clean applications. ✅ Environmentally Friendly – Complies with RoHS and REACH regulations, offering a sustainable and safe solution for lead-free soldering. Applications: • High-density interconnect (HDI) PCB assembly • Automotive electronics • Mobile devices and wearables • Medical and aerospace electronics • Fine-pitch components in consumer and industrial electronics